*Core materials: FeSiAl,FeSi, Hflux,Mpp,Amorphous ,Nanocrystalline
*Core shape: Toriodal,C-Core,EE,EI,PQ,POT
*Circuit topology: boost ,buck , ouput smooth filter
*DC current: 1-300A
*Ripple ratio: <20%
*Insultation reistance:DC500V, >100MΩ
*Housing materials: Burnt-resitive PBT or PA66 or stainless steel or aluminum
*Outline structure: PCB or Casing.
*RoHS and UL Compliant
*Switched mode power supply. such as ups.
*HF welding equipment. Such as inverter welding machine, plasma machine.
*Electrolytic and plating power supply.
*Charging power. Such as EV car, charging pile , PV inverter.
*Medical device. Such as x-ray ,laser power supply
*Induction heating system. Such as Mid-frequency furnace.
Because of application environment difference, every product will be costom-design by requirements.